IS-30i 30MM height
Performance grade down-pressure radiator
94×94MM is strictly limited to the heat dissipation area of the motherboard, making high-vest memory installation worry-free.
Nickel plated CD pattern copper base, welding process
High thermal conductivity copper bottom, precision milling; heat pipe copper bottom is connected by welding process, which conducts heat quickly.
Advanced reflow process
The heat pipe and fins are welded by the reflow soldering process and are integrated into one piece, which not only has excellent heat dissipation performance, but also extends the service life.
Ball bearing·thin fan
The rotation speed up to 3600RPM provides excellent air volume and pressure;
Ball bearings operate stably and further improve product durability.
Air volume: 40CFM
Wind pressure: 2.2MMH2O
PWM speed regulation
Precise speed control, 800-3600RPM can be controlled at will, suitable for both movement and stillness
Stable and appropriate, metal spring pressure buckle
Support NTELLGA1700/1200/115X platform
Product parameters
Product size: 94x94x30MM
Fan size: 92x92x12MM
Rated voltage: 12VDC
Rated current: 0.28A
Fan speed: 800±200~3600±10%RPM
Maximum air volume: 40 FCM
Maximum wind pressure: 2.2mmH20
Input power: 3.36W
Noise: 17~35.8dB(A)
Bearing type: ball bearing
| Weight | 13 kg |
|---|---|
| Dimensions | 6 cm |
| Brand Name | ID－COOLING |
| Cooler Type | Low Profile |
| Hign-concerned Chemical | None |
| Model Number | IS-30i |
| Power Interface | 4PIN |
| Blade Quantity | 9 |
| Fan Speed | 800 – 3600 |
| TDP | 120 |
| Supported CPU | LGA 1700 |
| Heatpipes | 4 |
| Fan Life | 100000 hrs |
| Air Volume | 40 |
| Bearing | Fluid Bearing |
| Air Pressure | 2.2 |
| Fan Size | 90 |
| Package | YES |
| Choice | yes |
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